Difference between revisions of "TARGET 3001! datasheet"
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| − | <br><big>'''[[New in | + | <br><big>'''[[New in V30|The new features in V30]]'''</big><br> |
| − | '''[[New in | + | |
| − | '''[[New in | + | '''[[New in V20|These were the new features in V20]]''' |
| + | '''[[New in V19|These were the new features in V19]]'''<br> | ||
| + | '''[[New in V18|These were the new features in V18]]'''<br> | ||
| + | '''[[New in V17|These were the new features in V17]]'''<br> | ||
| + | <br> | ||
== General == | == General == | ||
| − | |||
| − | |||
*program and documentation completely in English, French and German language | *program and documentation completely in English, French and German language | ||
*toggle between schematic and PCB | *toggle between schematic and PCB | ||
| + | *one single project file | ||
*double screen operation | *double screen operation | ||
*real time data integration (forward-/back-annotation not neccessary) | *real time data integration (forward-/back-annotation not neccessary) | ||
| Line 14: | Line 17: | ||
*real time air wire optimization | *real time air wire optimization | ||
*auto placer | *auto placer | ||
| − | + | *interface to ELECTRA® autorouter | |
| − | *interface to | + | *contour [[autorouter]] (shape based, gridless) |
| − | *contour [[ | ||
*hybrid auto router | *hybrid auto router | ||
*SQLite component database | *SQLite component database | ||
| Line 37: | Line 39: | ||
**XML IN/OUT | **XML IN/OUT | ||
**generic HPGL out | **generic HPGL out | ||
| − | **STEP 3D OUT | + | **STEP 3D IN/OUT |
**IDF 3D OUT | **IDF 3D OUT | ||
**GDS 2 OUT | **GDS 2 OUT | ||
**EAGLE® IN/OUT | **EAGLE® IN/OUT | ||
**Protel® IN | **Protel® IN | ||
| + | **PDF | ||
*insulation milling as outline engraving (directly from the program!) | *insulation milling as outline engraving (directly from the program!) | ||
| − | *maximum accuracy: vector graphics, resolution: 1nm = 1/1 | + | *maximum accuracy: vector graphics, resolution: 1nm = 1/1,000,000mm = 1/25,400,000" |
| − | *world coordinates: 1 | + | *world coordinates: 1" on screen = 1" on PCB (when zoom = 100%) |
| − | * | + | *2.0m x 2.0m (= 200cm x 200cm = 78.74" x 78.74") PCB-/schematic area |
| + | *up to 100 PCB layers, up to 100 schematic pages | ||
*components in current project directly editable: change pad, modify package etc. | *components in current project directly editable: change pad, modify package etc. | ||
*flip-chips and ball-grid-arrays (BGAs) supported | *flip-chips and ball-grid-arrays (BGAs) supported | ||
| Line 54: | Line 58: | ||
*symbol assistant | *symbol assistant | ||
*package assistant | *package assistant | ||
| + | *package generator (additionally provides 3D modelod a package) | ||
*outline assistant for easy generation of outlines with breakouts | *outline assistant for easy generation of outlines with breakouts | ||
*outlines of any shape | *outlines of any shape | ||
| Line 64: | Line 69: | ||
*automatic library updates | *automatic library updates | ||
*alignment assistant (allows geometrical alignment of a certain number of identic components) | *alignment assistant (allows geometrical alignment of a certain number of identic components) | ||
| + | |||
| + | == Editions and prices == | ||
| + | |||
| + | Please hava a look here: '''[http://ibfriedrich.com/en/index.html#products Editions and Prices]''' | ||
| + | <br><br> | ||
== In [[schematic]] mode == | == In [[schematic]] mode == | ||
| − | |||
*permanent forward-annotation to PCB | *permanent forward-annotation to PCB | ||
| Line 78: | Line 87: | ||
*Eagle(R) import and export (schematic files, board files) and library import to TARGET 3001! | *Eagle(R) import and export (schematic files, board files) and library import to TARGET 3001! | ||
*bill of material (BoM) with item number, purchase prices, deliverer etc. and custom fields | *bill of material (BoM) with item number, purchase prices, deliverer etc. and custom fields | ||
| − | *up to 100 schematic pages each up to | + | *up to 100 schematic pages each up to 4m² |
*electrical design check ERC | *electrical design check ERC | ||
| Line 84: | Line 93: | ||
== In [[PCB]] mode == | == In [[PCB]] mode == | ||
| − | |||
*permanent back-annotation to schematic | *permanent back-annotation to schematic | ||
*component packages in the layout can be edited free at any time | *component packages in the layout can be edited free at any time | ||
| + | *2m X 2m (= 78.74In by 78.74 In) board size and schematic size | ||
*air wires continually updated in display to aid placing | *air wires continually updated in display to aid placing | ||
*up to 100 layers (copper, solder stop, solder paste, gold etc.) | *up to 100 layers (copper, solder stop, solder paste, gold etc.) | ||
| Line 93: | Line 102: | ||
*any width of track, circular track, bezièr-curves, spirals, teardrops and custom padstacks | *any width of track, circular track, bezièr-curves, spirals, teardrops and custom padstacks | ||
*configurable autoplacer | *configurable autoplacer | ||
| + | *[[Push and shove]]: When manually routing, your current track will push away existing traces as far as needed (spacing rules are considered). | ||
*interactive and automatic routing, gridless shape based contour auto router with tconnections (copper sharing) and maintaining of all design rules, single-, double- and multilayer routing, routing of SMDs, of components and of solder pads rotated at any angle | *interactive and automatic routing, gridless shape based contour auto router with tconnections (copper sharing) and maintaining of all design rules, single-, double- and multilayer routing, routing of SMDs, of components and of solder pads rotated at any angle | ||
*new hybrid autorouter floating ground planes calculated in real time | *new hybrid autorouter floating ground planes calculated in real time | ||
| Line 111: | Line 121: | ||
*new layer tool with advanced layer-set- management | *new layer tool with advanced layer-set- management | ||
*3D view | *3D view | ||
| − | + | *MID design/layout (dedicated edition) | |
| − | |||
== [[Assembly Service]] == | == [[Assembly Service]] == | ||
| − | |||
*in cooperation with PCB-POOL® | *in cooperation with PCB-POOL® | ||
| Line 127: | Line 135: | ||
== Mixed mode [[simulation]] == | == Mixed mode [[simulation]] == | ||
| − | |||
*completely reviewed new graphical user interface | *completely reviewed new graphical user interface | ||
| Line 159: | Line 166: | ||
== [[EMC Check|EMC-analysis]] == | == [[EMC Check|EMC-analysis]] == | ||
| − | |||
*define several parameters concerning the PCB and concerning the already placed tracks | *define several parameters concerning the PCB and concerning the already placed tracks | ||
| Line 170: | Line 176: | ||
'''Remark:''' The EMC tool tends to be an expert system rather than an exact analysis tool. Those tools play in a different league (!)<br><br> | '''Remark:''' The EMC tool tends to be an expert system rather than an exact analysis tool. Those tools play in a different league (!)<br><br> | ||
| + | |||
| + | |||
== [[Frontpanel|Front panel design]] == | == [[Frontpanel|Front panel design]] == | ||
| Line 177: | Line 185: | ||
*superposed design of PCB and frontpanel | *superposed design of PCB and frontpanel | ||
*huge amount of milling images ready for use | *huge amount of milling images ready for use | ||
| + | *digital print of your images on the front panel | ||
*price calculation of the frontpanel when producing with WK-Mechanik | *price calculation of the frontpanel when producing with WK-Mechanik | ||
*price calculation of the frontpanel when producing with PCB-POOL® (incl. digital print) | *price calculation of the frontpanel when producing with PCB-POOL® (incl. digital print) | ||
*ordering instantly from TARGET 3001! | *ordering instantly from TARGET 3001! | ||
| − | + | ||
| + | |||
== [[System requirements]] == | == [[System requirements]] == | ||
| + | Hardware and software required when using the current version of TARGET 3001! | ||
| − | *Operating | + | *Operating system: (Windows XP*, Vista), Windows 7, Win7, Windows 8, Win8, Win 10, Linux** |
| − | * | + | *Processor: at least 2 GHz Intel/AMD |
| − | * | + | *Memory: at least 1 GB |
| − | * | + | *Graphics: at least 1024x800 pixel, Open-GL support for 3D view |
| − | * | + | *Graphics memory: 1 GB |
| − | *Internet access (needed for | + | *[[Online|Internet access]] (needed for program help (Wiki), program update, component data base update, data sheets, commercial features and online communication to IBF.) |
[[de:TARGET 3001! Datenblatt]][[fr: TARGET 3001! fiche technique]][[Category: About TARGET 3001!]] | [[de:TARGET 3001! Datenblatt]][[fr: TARGET 3001! fiche technique]][[Category: About TARGET 3001!]] | ||
Latest revision as of 17:39, 10 February 2021
These were the new features in V20
These were the new features in V19
These were the new features in V18
These were the new features in V17
Contents
General
- program and documentation completely in English, French and German language
- toggle between schematic and PCB
- one single project file
- double screen operation
- real time data integration (forward-/back-annotation not neccessary)
- real time ground plane computation
- real time air wire optimization
- auto placer
- interface to ELECTRA® autorouter
- contour autorouter (shape based, gridless)
- hybrid auto router
- SQLite component database
- drag & drop component placement
- clipboard as a documentation interface
- intuitive Windows user interface
- free version “Discover” can be used as viewer
- viewer available separately
- undo/redo (50 steps)
- interfaces:
- insulation milling as outline engraving (directly from the program!)
- maximum accuracy: vector graphics, resolution: 1nm = 1/1,000,000mm = 1/25,400,000"
- world coordinates: 1" on screen = 1" on PCB (when zoom = 100%)
- 2.0m x 2.0m (= 200cm x 200cm = 78.74" x 78.74") PCB-/schematic area
- up to 100 PCB layers, up to 100 schematic pages
- components in current project directly editable: change pad, modify package etc.
- flip-chips and ball-grid-arrays (BGAs) supported
- rotation by any angle e.g. chip on board technology
- free displacable tools
- hierarchical design by block diagrams
- generation of alternative assemblies in schematic and layout (variants)
- symbol assistant
- package assistant
- package generator (additionally provides 3D modelod a package)
- outline assistant for easy generation of outlines with breakouts
- outlines of any shape
- color code calculator for resistors and capacitors
- calculation of the track width for high current
- online help system
- frontpanel engraving tool
- texts in 3 languages simultaneously
- update manager for automatic program and driver updates
- automatic library updates
- alignment assistant (allows geometrical alignment of a certain number of identic components)
Editions and prices
Please hava a look here: Editions and Prices
In schematic mode
- permanent forward-annotation to PCB
- more than 40,000 logic components (DIN/IEEE) in the database (internet access for db update needed)
- automatic component numbering
- inserted symbols still can be edited or adapted (independently from database)
- parametric search of components
- Component Management System (CMS)
- import of Mentor(R) and Orcad(R) netlists if needed
- output of individual component lists and netlists (also in Protel, Orcad and Calay format)
- Eagle(R) import and export (schematic files, board files) and library import to TARGET 3001!
- bill of material (BoM) with item number, purchase prices, deliverer etc. and custom fields
- up to 100 schematic pages each up to 4m²
- electrical design check ERC
In PCB mode
- permanent back-annotation to schematic
- component packages in the layout can be edited free at any time
- 2m X 2m (= 78.74In by 78.74 In) board size and schematic size
- air wires continually updated in display to aid placing
- up to 100 layers (copper, solder stop, solder paste, gold etc.)
- any solder pad shapes: circular, octagonal, oblong, etc.
- any width of track, circular track, bezièr-curves, spirals, teardrops and custom padstacks
- configurable autoplacer
- Push and shove: When manually routing, your current track will push away existing traces as far as needed (spacing rules are considered).
- interactive and automatic routing, gridless shape based contour auto router with tconnections (copper sharing) and maintaining of all design rules, single-, double- and multilayer routing, routing of SMDs, of components and of solder pads rotated at any angle
- new hybrid autorouter floating ground planes calculated in real time
- configurable real time design rule check (DRC)
- PCB generation and routing without schematic
- splitting a schematic off the layout
- Gerber file import for further edition (e.g. from other design software programs)
- lots of PCB houses directly accept TARGET *.T3001files
- formats *.tgr (Polar Instruments) and *. dif (digitaltest) supported (E-testing)
- 3D-view on button click
- format *.idf supported (transfer of 3D data to other mechanical CAD systems)
- generation of panels
- generation of testing points
- selection assistant (allows the selection by properties)
- list of the last 20 components used
- automatic PCB enquiries and –orders
- automatic component enquiries and –orders
- new layer tool with advanced layer-set- management
- 3D view
- MID design/layout (dedicated edition)
Assembly Service
- in cooperation with PCB-POOL®
- calculate the assembly of your board
- define where to purchase the parts
- use standard parts from PCB-Pool® stock
- add any own parts for assembly (welcome in a bag)
- automatic assembly from one(!) piece of PCB
Mixed mode simulation
- completely reviewed new graphical user interface
- Spice blocks no longer needed
- dialogues as assistants
- help in dialogues- with graphical explanations
- eased model edition
- model browser enlarged (with Syntax-Error messages also)
- Subcircuit Generator enlarged
- Level ("Simulation-group") new defined, generalized
- all basic simulator elements available in the library, virtual components too
- Component import (with model) in tree view technique possible
- PWL-Editor
- Graphical entry of PWL-curve
- interactive elements self definable:individual virtual instruments can be generated
- texts as value display
- filled objects as flashing elements
- rectangles as oscilloscopes
- MOSFETs: parameters L and W also implemented into the model card (PSPICE®-Syntax), so MOSFet-Models from manufacturers (Internet, gen PSPICE®-Syntax) can be imported SPICE3F5 and PSPICE® compatible
- Graphical entry of the circuit – circuit simulation interactive circuit symbols
- mixed mode simulation (analog + digital)
- Analyses: DC sweep, AC sweep and transient
- automatical control of step widths in transient analysis
- event driven digital simulator
- delay, setup, hold…
- times for digital basic elements
- postprocessor (oscilloscope) for view and analysis
- graphical subcircuit generator
EMC-analysis
- define several parameters concerning the PCB and concerning the already placed tracks
- critical tracks are automatially highlighted and checked with respect to their emissions and self interference
- PCB is checked against all EMC design rules whilst designing
- handling and evaluation of the results by Windows tree-view-technique
- calculations implemented: galvanic-, inductive-, capacitive- and radiation coupling
- computation of the coupling factor, wave resistance and maximum track length
- numerous tips for successful EMC-adequate PCB design.
Remark: The EMC tool tends to be an expert system rather than an exact analysis tool. Those tools play in a different league (!)
Front panel design
- use all drawing functions you already are familiar with
- no double entry of coordiantes
- superposed design of PCB and frontpanel
- huge amount of milling images ready for use
- digital print of your images on the front panel
- price calculation of the frontpanel when producing with WK-Mechanik
- price calculation of the frontpanel when producing with PCB-POOL® (incl. digital print)
- ordering instantly from TARGET 3001!
System requirements
Hardware and software required when using the current version of TARGET 3001!
- Operating system: (Windows XP*, Vista), Windows 7, Win7, Windows 8, Win8, Win 10, Linux**
- Processor: at least 2 GHz Intel/AMD
- Memory: at least 1 GB
- Graphics: at least 1024x800 pixel, Open-GL support for 3D view
- Graphics memory: 1 GB
- Internet access (needed for program help (Wiki), program update, component data base update, data sheets, commercial features and online communication to IBF.)