Glossary
This glossary gives a review on some main terms and items used in TARGET 3001!
Circuit or Project: A generic term for the schematic and PCB. Both will be saved in one file (*.T3001). It is possible to have a couple of projects open in TARGET 3001! with one or more open windows of each project. It is possible to have a window of the schematic- and a window of the PCB- file open on the screen. For edition of both, simply toggle between the schematic- and the PCB- window with the [F3] key.
Schematic: A diagram that shows the electrical perspectives between the connections of components through inter connections done with signal wires and buses.
PCB: Printed circuit board, presentation of the electrical connections of the pins of component packages with solder pads and signal tracks. A PCB can be made out of one or more of the following: ground planes, deletion layers, solder resist layers, insertion legend print layer, solder paste layer, gold coating layer, adhesive coating layer and dimensioning layer, outline layer, routing data layer and a drill hole layer. Up to 100 layers are possible. All layers are viewed from the top (top view). Layers with a lower layer number can be found below layers with a higher layer number. Therefore the solder side of the PCB will be viewed from the top, imagine the PCB is made of glass. An insertion legend print on this layer must be visible mirrored on the computer screen.
Component: For a schematic, a component is made of one or more symbols. To simulate a circuit, only the components simulation model is of interest. A PCB designer is interested in the package of a component. A CD4000 standard CMOS component contains 2 x NOR-symbols, 1 x NOT-Symbol and 1 x POWER-Supply Symbol as well as a GND symbol. To convert a schematic into a PCB, each symbol has to be assigned to an available package. (DIL14 or SMD14). While importing from a library, each component will be automatically assigned with an identification number. Acomponent can have a name (IC17;R8) and a value (CD4000;4K7).
Rests of components: Rests of components are of interest for the layouter later in the design process. If you e.g. import a 7400 from a library you intend to place a NAND-Gate to your circuit. The according VCC/GND power-connections are fixed later, when the general function of the circuit is designed. Those supply symbols are combined to a separate symbol which are inserted separately by "Import rests of components" in Menu "Components" to your circuit. They need to be connected manually in any case. If not you will receive error messages like "Power without supply" when using the function "Check project".
Symbol: A symbol is a schematic representation of a component or parts of it, for example a gate. It is made of a handle (small cross), its drawing (with a symbol name or a component name and a component value) and the according pins.
Reference Symbol: Reference symbols are used for connections which shall not or can not be displayed as green wires (e.g. in a schematic having more than one page). For example +,-, GND or any in or outgoing signals. By identity of name the connection is made.
Package: A package is a physical representation of a component, necessary for the printed circuit board design. It is made of a handle (small cross), its drawing (outline, maybe with a component name and a component value) and the according pads as footprints (DIL- or SMD-type). It is part of a component.
Pin: A pin in TARGET 3001! is a schematic representation of a connection of a electronic component. It has always a pin number and sometimes a pin name. A pin belongs to a symbol and therefore to the component. If this pin is connected in the schematic, it is also part of a signal. Pins not connected, are marked with a small cross at its end. The cross disappears as soon as this pin gets connected.
(Solder) Pad: A solder pad is a physical representation of a connection on the printed circuit board. Such a pad has always a pin number. A pad belongs to a and therefore to the component. It is part of a signal, if the corresponding pin is connected in the schematic. The association between a pin in schematic and its pad on PCB is exclusively dependent on an identical pin number. A pad with a drill hole appears usually on all copper layers (special layer 100 = all copper layers, or beginning with layer 101 = pad stack). The drill hole diameter for SMD ( surface-mounted-devices) pads is zero and it has a normal copper layer (e.g. 16=copper top).
Signal: A signal in TARGET 3001! is an assigned characteristic. For a schematic, it can contain pins, signal traces, signal tori, signal curves, and junctions (knots) whereas it contains pads, tracks, tori and track curves, bridges, through-holes and vias on the PCB. To see if two pins or signals are connected, verify their affiliation to the same signal.
Drawing/Design: A drawing can be made of the following graphical elements: line, triangle,rectangle, slice, torus, curve, orientation mark and text.
Junction / Node (Knot): In the schematic, a junction is used to connect crossing signal traces or to show their connection. A junction is made of a slice which is bigger than the crossing signal tracks.
Node: All signals are assigned to nodes in the simulation program. Because the simulation program sometimes adds internal nodes, their final amount can be higher than the number of signals in the schematic.
Bus: A bus in the schematic is a collection of signal names. All signals can be connected to a bus. It is possible to distinguish graphically between separate busses (databus, addressbus ...), but TARGET 3001! allows to get any signal out of any bus ( for example address line A7 from the databus). To make the signal name of the outgoing signal visible, please hover the mouse over the wire and press [n]. In the flashing dialog just enter OK.
Via: A via is a plated through-hole of all copper layers of a printed circuit board (special layer = 100). For the production, it is important to have a sufficient residual ring around the plated through-hole. Please refer to "padstacks" too.
Bridge: A bridge is a wire connection between two points on the PCB. The solder pads of the bridge are made of the current vias. The drawing of the wire should be made on the position layer.
Element: An element is a database assignment for all elements of a drawing.
Page: TARGET 3001! is capable to handle up to 100 schematic pages. Connections between different pages can be made by using reference symbols. The gnd-symbol is a well known reference symbol. These connections can also be reached through bus-islands on different pages. Basically, the same signal name = the same signal = connected.
Layer:TARGET 3001! is capable to handle up to 100 printed circuit board layers. (0..99). Each layer can be switched visible and invisible. Each layer can be assigned to a special function, for example: copper layer, position layer, solder-resist layer... All layers (even copper bottom) will be displayed as a view from top. Imagine the PCB was made of glass. Special layers are layer 100 for all copper layers and layers 101...250 for padstacks. Please refer to "padstacks" too.
Simulation: The schematic can be tested and evaluated by the use of the mixed-mode simulator. The simulator in TARGET 3001! is PSPice-and Spice 3f5 compatible. The amount of signals handled by the simulator is different according to the version purchased.
EMC Analysis: An integrated tool to check the routed PCB regarding all design rules recommended for electromagnetic compatibility (EMC). The inductive, capacitive and galvanic coupling of the tracks as well as the radiation value of individual signals are displayed.
Padstack: A padstack is a plated through-hole of several (not all) copper layers. Padstacks are distinguishable between types that will be drilled only from one side (blind via) and types that connect only the inner layers of a PCB. These types are invisible from the outside (buried via).
Drillhole: You will not find a simpleelement that represents a simple drillhole as a mounting hole in TARGET 3001!. Place a via and set its pad size dimensions smaller than the drillhole size. Also, you should delete its signal.
Mode: Depending on the project status, TARGET 3001! can be operating in different modes. The status line (bottom of screen) shows the current mode. The status line shows also the dependencies of several keys with their individual meaning in the according mode.
Options: With the options feature in the according mode, it is possible to define the settings for elements to be placed in the future. (key [o] for options). For example: While you work in the mode "Draw Tracks" it is possible to set the properties for tracks to be placed next (layer, width...).
Edit: The currently selected elements can be changed by pressing the [e] key or by selecting the menu Edit / Change command. This means it concerns elements which were created in the past.