Documentation

Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique (principle: baking oven). Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils. The pattern of the soldering pads exactly is cut out of a thin sheet of steel by the use of a laser. The steel sheet with the pattern of holes is the stencil.

Die Stahlplatte mit Lochmuster ist der Stencil. Er wird deckungsgleich auf die Platine gelegt und mit einem Rakel wird dann die Lötpaste darüber gestrichen. In den Löchern über den Pads bleibt die Lötpaste zurück und beim Abnehmen der Schablone verbleiben kleine Lotdepots auf den Pads.

Solderpaste on pads in TARGET 3001! can be edited in the dialog "Change Pads". Open it by doubleclick M11 on a pad. Another way is highlighting the complete layout and then pressing key [e] for edit. Select "Pads" in the flashing dialog and do the solder paste settings in the "Change pads" dialog.

Also see: Pad Aura SMD Solder stop Test points Thermal Pads Oblong hole Used pins/pads Via Drillhole Soldering pad having different auras upon different layers Two pads leading one signal

You may reduce the dispension of solder paste on each pad individually by 5, 10, 15, 20, and 25% relative to the size of the pad. You also may keep pads completely free of solder paste in order to draw a figure of customized (smaller) size on the solder paste layer.

Information on Solder stop please see there...