Documentation

also see:

• Pad
• Aura
• SMD
• Solder paste
• Solder stop
• Test points
• Thermal Pads
• Used pins/pads
• Via
• Drillhole
• Soldering pad having different auras upon different layers
• Two pads leading one signal

An oblong hole in datasheets often are displayed that way:

It is a "Drillhole" brought to length.

Draw the pad in it's desired form and create the oblong hole as a milling. The milling itself you draw as a line having the desired dimensions upon the milling layer (by default layer 25, Milling). The width/length of the drawn line defines the dimensions of the milling.

The following image shows the principle of creating a lengthened octagonal pad having a drillhole and having a milling command over it on layer 25 (brown). Change the pad form to "Oblong" in the pad dialog.

Now push the milling in position using M1H.

Your PCB house will mill the oblong hole accordingly. As long as a copper rest ring remains around the milling, the figure gets plated through. Take care that no vias are placed here. For clarifying the situation towards your PCB-house you should add a little explanatory text in respect to the milling here.

You also might place the milling on layer 23, Outline. Outline information gets milled anyway. Regarding the "plating through" in this case please contact your PCB house how they handle such.

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