Solder paste: Difference between revisions
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Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique (principle: baking oven). Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils. The pattern of the soldering pads exactly is cut out of a thin sheet of steel by the use of a laser. The steel sheet with the pattern of holes is the stencil. | Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique (principle: baking oven). Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils. The pattern of the soldering pads exactly is cut out of a thin sheet of steel by the use of a laser. The steel sheet with the pattern of holes is the stencil. | ||
[[image:stencil.jpg|Bildquelle: www.pcb-pool.com]]<br>A stencil for the application of solder paste<br> | |||
The stencil gets exactly superposed over the PCB and with a doctor knife the solder paste is spread and scraped off the steel. A little bit of the paste remains in the holes over the pads. When the stencil is taken off, these little depots are to be found exactly where they are supposed to be: on the pads. | |||
The size of the little solderpaste depots on pads can be edited in TARGET 3001! in the dialog '''"Change Pads"'''. Open it by doubleclick '''[[M11]]''' on a pad. Another way is highlighting the complete layout and then pressing key '''[e]''' for <u>e</u>dit. Select "Pads" in the flashing dialog and do the solder paste settings in the "Change pads" dialog.<br><br> | |||
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Revision as of 09:45, 16 September 2015
Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique (principle: baking oven). Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils. The pattern of the soldering pads exactly is cut out of a thin sheet of steel by the use of a laser. The steel sheet with the pattern of holes is the stencil.
A stencil for the application of solder paste
The stencil gets exactly superposed over the PCB and with a doctor knife the solder paste is spread and scraped off the steel. A little bit of the paste remains in the holes over the pads. When the stencil is taken off, these little depots are to be found exactly where they are supposed to be: on the pads.
The size of the little solderpaste depots on pads can be edited in TARGET 3001! in the dialog "Change Pads". Open it by doubleclick M11 on a pad. Another way is highlighting the complete layout and then pressing key [e] for edit. Select "Pads" in the flashing dialog and do the solder paste settings in the "Change pads" dialog.
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Also see: |
You may reduce the dispension of solder paste on each pad individually by 5, 10, 15, 20, and 25% relative to the size of the pad.
You also may keep pads completely free of solder paste in order to draw a figure of customized (smaller) size on the solder paste layer.
Information on Solder stop please see there...