Solder paste: Difference between revisions
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Revision as of 09:00, 16 September 2015
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Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique. Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils.
Solderpaste on pads in TARGET 3001! can be edited in the dialog "Change Pads". Open it by doubleclick M11 on a pad. Another way is highlighting the complete layout and then pressing key [e] for edit. Select "Pads" in the flashing dialog and do the solder paste settings in the "Change pads" dialog.
You may reduce the dispension of solder paste on each pad individually by 5, 10, 15, 20, and 25% relative to the size of the pad.
You also may keep pads completely free of solder paste in order to draw a figure of customized (smaller) size on the solder paste layer.
Information on Solder stop please see there...