Solder paste: Difference between revisions
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also see:<br> | |||
*[[Pad]] | |||
*[[Aura]] | |||
*[[SMD]] | |||
*[[Solder stop]] | |||
*[[Test points]] | |||
*[[Thermal Pads]] | |||
*[[Oblong hole]] | |||
*[[Used pins/pads]] | |||
*[[Via]] | |||
*[[Drillhole]] | |||
*[[Soldering pad having different auras upon different layers]] | |||
*[[Pad#Special:_Two_pads_leading_one_Signal|Two pads leading one signal]] | |||
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Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique. Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils. | Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique. Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils. | ||
Revision as of 14:49, 13 March 2013
also see:
- Pad
- Aura
- SMD
- Solder stop
- Test points
- Thermal Pads
- Oblong hole
- Used pins/pads
- Via
- Drillhole
- Soldering pad having different auras upon different layers
- Two pads leading one signal
Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique. Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils.
Solderpaste on pads in TARGET 3001! can be edited in the dialog "Change Pads". Open it by doubleclick M11 on a pad. Another way is highlighting the complete layout and then pressing key [e] for edit. Select "Pads" in the flashing dialog and do the solder paste settings in the "Change pads" dialog.
Information on Solder stop please see there...