Documentation

Difference between revisions of "Signal polygon"

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<b>Wärmefallen erzeugen:</b> Der Lötpunkt eines Bauteilbeinchen mit dem gleichen Signal wie die Fläche, z. B. GND müsste vollflächig eingebettet sein um bestmöglich angeschlossen zu sein. Beim Löten allerdings würde zu schnell zu viel Wärme in die Massefläche abfließen, so dass sich das Lot nicht optimal mit dem Kupfer verbindet. Als Wärmefalle bezeichnet man einen Lötpunkt, der stattdessen mit einem Sicherheitsabstand (Aura) umgeben ist und lediglich mit kleinen Stegen an die Massefläche angeschlossen ist. Dadurch fließt die Wärmeenergie beim Löten nicht zu schnell in die Fläche ab. Diese Stege können kreuzförmig, y-förmig oder gradlinig sein. Siehe auch [[Thermal Pads ]].<br><br>
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<b>Create thermal pads:</b> A thermal pad is a connecting pad which is not completely embedded to the plane but it connects only by small ligaments. It effects reduced heat dissipation into the plane. This supports good connection of solder agens and copper pad. Those ligaments can look crosswise, y-shaped or straight. Also see [[Thermal Pads]].<br><br>
  
 
[[image: signalpolygone_thermal.jpg]]<br>
 
[[image: signalpolygone_thermal.jpg]]<br>
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The pads numbered 1 of the two components being located to two polygons. Left with thermal pads, right without.<br><br><br>
  
Die Pads Nummer 1 von zwei Bauteilen in zwei Potenzialflächen. Links mit Wärmefallen, rechts ohne.<br><br><br>  
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<b>Delete islands:</b> A not connected piece of a signal polygon is called an "Island". They are also called "Orphans". They dont have any purpose and mostly make trouble. So they should be removed. TARGET does this automatically if you tick the box. A ground plane gets connected by a pad of a component, A via having an aura of 0 upon this layer or a piece of track running through the polygon plane and having aura =0. Always the signal name (the signal) must be identical. <br><br>
  
<b>Inseln entfernen:</b> Ein nicht angeschlossenes Stück einer Potenzialfläche heißt "Insel". Man kennt auch den Begriff "schwebende Massefläche". Sie haben keinen Zweck und stören nur. Deshalb entfernt man sie. TARGET macht das automatisch, wenn Sie den Haken hier setzen. Der Anschluss einer Massefläche erfolgt durch ein angeschlossenes Pad eines Bauteils, einer Durchkontaktierung mit Aura 0 auf dieser Ebene oder ein Stück Leiterbahn durch die Fläche mit Aura 0. Immer muss der Signalname (=das Signal) identisch sein. <br><br>
 
  
 
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<b>Fill directly :</b> The polygon immediately gets created wit all interactions to all other elements. This process can take some seconds in bigger projects. Therefore you can switch it off here by unticking the box. By default the box is ticked.<br><br><br><br>
<b>Sofort füllen:</b> Das Polygon wird sofort im Zusammenspiel mit anderen Polygonen und Elementen unter allen Aspekten erzeugt. Dieser Prozess kann in größeren Designs unter Umständen einige Sekunden dauern. Deshalb kann man dies hier kurzfristig abschalten.<br><br><br><br>
 
  
  

Revision as of 16:42, 26 July 2017

Icon
Icon to be found in the layout view among the drawing functions


General

A signal polygon can be handled like a separate ground plane. It can individually be furnished with attributes. On one copper layer any number of polygones with different signals can be drawn.


You can reach this mode:


What you can do

Define the corners of the polygone by M1. You can close the polygone automatically by [Return] when drawing the last segment. M2 does the same so that you end the line exactly on the starting point. Immediately the dialog for edition of the signal polygon opens.

Dialog for signal polygon edition
The dialog for signal polygon edition


Layer: a polygon with signal assignment can only be created on a copper layer. The copper layers used in your project can be selected from the drop down list. Select the copper layer upon which your polygon later shall appear (copper bottom, copper top, copper inside).

Signal: Select the signal to be assigned to the polygon. At this point you can only assign one signal to one polygon. Creating a Star shaped ground is a separate topic. Please have a look there.

Track width: In easy words track width is the thickness of the pen which you use to fill the polygon with color. Sounds a bit childish but in respect to the production technique it is the best way to compare. In Gerber a photo pen follows the lines on a photosensitive board with an aperture according to the track width. The sharper the tip of the pen, the more filigree structures can be built. Discuss the smallest value with your PCB-house. Here in Europe the minimum value of 0.15 mm is common.

The following picture shows the polygon with a little notch see arrow. The reason is a track width set too wide. The pen can not go through this bottle neck.

Track width too big
Track width too big to close the area at this spot.

Referring to the track width set here the DesignRuleCheck later checks whether the minimum track width od a connection is fulfilled. The track width must also be seen in combination with the "Grid spacing". A gridded ground plane in consists of a net-structure made of orthogonal intersecting lines. The width of this lines you also define here. You can only enter one value for the track width here. The net structure (= ground plane in lines) always has a square mesh structure.

Grid spacing: A ground plane in lines offers production advantages in galvanization and also is preferable in respect to electromegnetic performance of the signal. In addition to the track width you can define the distance of the mesh.

Ground plane in lines
Copper top: Ground plane in lines (to the right). Track width: 0.3mm, Grid spacing: 0.5mm


PCB edge spacing: It is helpful to have a little spacing between ground plane and cutting edge of the PCB. It can avoid a short circuit by just touching the board by any other object. Also a crosstalk of the signal can be avoided. Cutting edge is middle of the PCB outline.


Distance of the polygon to the cutting edge of the board
Distance to the edge: left without, right with "stand back" from the edge of the board. In the image to the right the left polygon shows a PCB edge spacing of 0.8mm, the one right beside shows a spacing to the edge of 0.4mm.


Rank: Polygons can overlap, they even can interlace - sure they never should touch each other. Which of the polygons should dominate the other (taking away some of the others shape) can be defined by its rank. The higher the cipher of the rank of a polygon is, the more dominant it is. A polygon with rank 2 dominates a polygon having only rank 1. This means the one with rank 2 takes away the overlapping from the one with rank 1 and so on. There are 99 ranks possible.

Signalpolygonrang e.jpg
Copper bottom: Interlacing polygons with different signals and different ranks.


Create thermal pads: A thermal pad is a connecting pad which is not completely embedded to the plane but it connects only by small ligaments. It effects reduced heat dissipation into the plane. This supports good connection of solder agens and copper pad. Those ligaments can look crosswise, y-shaped or straight. Also see Thermal Pads.

Signalpolygone thermal.jpg
The pads numbered 1 of the two components being located to two polygons. Left with thermal pads, right without.


Delete islands: A not connected piece of a signal polygon is called an "Island". They are also called "Orphans". They dont have any purpose and mostly make trouble. So they should be removed. TARGET does this automatically if you tick the box. A ground plane gets connected by a pad of a component, A via having an aura of 0 upon this layer or a piece of track running through the polygon plane and having aura =0. Always the signal name (the signal) must be identical.


Fill directly : The polygon immediately gets created wit all interactions to all other elements. This process can take some seconds in bigger projects. Therefore you can switch it off here by unticking the box. By default the box is ticked.