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Ligaments in a pad: Difference between revisions

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[[image:thermalpad.jpg]]<br>Image: Are you thinking of something like this?<br><br><br>
[[image:thermalpad.jpg]]<br>Image: Are you thinking of something like this?<br><br><br>


In the TARGET 3001! usage this construction is called '''[[Thermal pad]]'''. Ein Pad mit Massesignal ist nicht vollflächig in die Massefläche eingebettet sondern nur über Stege mit ihr verbunden. Hierdurch soll verhindert werden, dass beim Löten die Wärme zu schnell in die Massefläche abfließt, was zu sog. "kalten Lötstellen" führen kann (Lot sitzt zwar auf dem Pad, hat aber keine elektrische Verbindung).  
In the TARGET 3001! usage this construction is called '''[[Thermal Pads|a thermal pad]]'''. A pad with a ground signal is not going to be embedded completely into the Ground plane but gets connected only ba ligaments. It is to avoid a "drain too quick" of soldering temperature into the ground plane. Because this might lead to "cold solder joints" (solder agens placed on the pad but no conducting junction).  


In TARGET findet der Anschluss an eine Massefläche über die Signalbahn statt, die keine Aura hat. Die Signalbahn ist also in die Massefläche eingebettet, nicht das Pad. Ein Pad behält grundsätzlich die Aura auf allen Ebenen. So gesehen, ist ein TARGET-Pad die bestmögliche Wärmefalle. Hier Stege anzubringen, die in die Massefläche führen, ist einem Wärmeerhalt eher abträglich. Aus rein optischen Gründen wird es aber trotzdem gerne gemacht. Bitte schauen Sie im Artikel [[Wärmefalle]] wie man das in TARGET konstruiert.<br>
In TARGET the connection of a ground plane takes place by the ground signal being embedded to the ground plane. Its signal track has no aura. The signal track is embedded to the ground plane, not the pad. A pad in general keeps it's aura on all layers except you actively would delete it on certain layers. In this respect a TARGET pad in a groundplane provides the best thermal commodities. Adding ligaments here which lead into the ground plane reduce the sustain of temperature. For optical reasons it is done nevertheless. Please have a look at the article [[Thermal Pads]] to gather further information.<br>




alias: Stege im Lötpunkt, Brücken im Pad, Brücken im Lötpunkt
alias: bridge in a pad




Latest revision as of 13:23, 13 November 2015


Image: Are you thinking of something like this?


In the TARGET 3001! usage this construction is called a thermal pad. A pad with a ground signal is not going to be embedded completely into the Ground plane but gets connected only ba ligaments. It is to avoid a "drain too quick" of soldering temperature into the ground plane. Because this might lead to "cold solder joints" (solder agens placed on the pad but no conducting junction).

In TARGET the connection of a ground plane takes place by the ground signal being embedded to the ground plane. Its signal track has no aura. The signal track is embedded to the ground plane, not the pad. A pad in general keeps it's aura on all layers except you actively would delete it on certain layers. In this respect a TARGET pad in a groundplane provides the best thermal commodities. Adding ligaments here which lead into the ground plane reduce the sustain of temperature. For optical reasons it is done nevertheless. Please have a look at the article Thermal Pads to gather further information.


alias: bridge in a pad

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