Documentation

Image: Are you thinking of something like this?

In the TARGET 3001! usage this construction is called a thermal pad. A pad with a ground signal is not going to be embedded completely into the Ground plane but gets connected only ba ligaments. It is to avoid a "drain too quick" of soldering temperature into the ground plane. Because this might lead to "cold solder joints" (solder agens placed on the pad but no conducting junction).

In TARGET the connection of a ground plane takes place by the ground signal being embedded to the ground plane. Its signal track has no aura. The signal track is embedded to the ground plane, not the pad. A pad in general keeps it's aura on all layers except you actively would delete it on certain layers. In this respect a TARGET pad in a groundplane provides the best thermal commodities. Adding ligaments here which lead into the ground plane reduce the sustain of temperature. For optical reasons it is done nevertheless. Please have a look at the article Thermal Pads to gather further information.

alias: bridge in a pad