New in V19: Difference between revisions
No edit summary |
No edit summary |
||
| Line 5: | Line 5: | ||
<b>Dear TARGET 3001! - user,</b> | <b>Dear TARGET 3001! - user,</b> | ||
we are happy to present version '''V19''' to you. Improving the '''ground plane performance''' was the key driver for the development of the new version. A new polygon algorithm allows individual handling of any plane shape with any electrical potential on a copper side of your board. Any ground polygon can be furnished with a rank in order to dominate overlapping parts of other polygons having a different ground potential. | we are happy to present version '''V19''' to you. Improving the '''ground plane performance''' was the key driver for the development of the new version. A new polygon algorithm allows individual handling of any plane shape with any electrical potential on a copper side of your board. Any ground polygon can additionally be furnished with a rank in order to dominate overlapping parts of other polygons having a different ground potential. | ||
Furthermore in Insulation milling there is a new calculator | Furthermore in Insulation milling there is a new calculator to define the immersion depth of the engraving tool. This helps to define the rub out width of the tool. | ||
Before creating a Bill Of Material (BOM) now parameters can be defined as "project varables". This enhances the informative value of your BOM.<br><br> | Before creating a Bill Of Material (BOM) now parameters can be defined as "project varables". This truly enhances the informative value of your BOM.<br><br> | ||
We are looking forward to your feedback! | We are looking forward to your feedback! | ||
| Line 25: | Line 25: | ||
|<span class="plainlinks">[[image:go.png]]||'''✔ [[Bill_of_Material_BOM#The_list_of_the_BoM|Boost your BoM by additional parameters]]</span> | |<span class="plainlinks">[[image:go.png]]||'''✔ [[Bill_of_Material_BOM#The_list_of_the_BoM|Boost your BoM by additional parameters]]</span> | ||
|- | |- | ||
|<span class="plainlinks">[[image:go.png|link= | |<span class="plainlinks">[[image:go.png|link=License]]||'''✔ More featueres?'''<br> Yes: With V19 you can get all updates for free including all new features and changes until the day when the next version, V20, will be released.</span> | ||
|- | |- | ||
|[[image:logbook.png|http://www.target-3001.de/target/english/logbook.txt]]||'''✔ [http://www.target-3001.de/target/english/logbook.txt Logbook]!'''<br> '''Up to date:''' Browse the logbook to find out the latest features and changes... | |[[image:logbook.png|http://www.target-3001.de/target/english/logbook.txt]]||'''✔ [http://www.target-3001.de/target/english/logbook.txt Logbook]!'''<br> '''Up to date:''' Browse the logbook to find out the latest features and changes... | ||
Revision as of 09:02, 28 July 2017
 |
 Free DOWNLOAD V19 discover |
Dear TARGET 3001! - user,
we are happy to present version V19 to you. Improving the ground plane performance was the key driver for the development of the new version. A new polygon algorithm allows individual handling of any plane shape with any electrical potential on a copper side of your board. Any ground polygon can additionally be furnished with a rank in order to dominate overlapping parts of other polygons having a different ground potential.
Furthermore in Insulation milling there is a new calculator to define the immersion depth of the engraving tool. This helps to define the rub out width of the tool.
Before creating a Bill Of Material (BOM) now parameters can be defined as "project varables". This truly enhances the informative value of your BOM.
We are looking forward to your feedback!
Yours sincerely,
Harald Friedrich and the TARGET 3001! Team
 |
✔ Ground plane polygons |
|
✔ Engraving bit calculator |
|
✔ Boost your BoM by additional parameters |
 |
✔ More featueres? Yes: With V19 you can get all updates for free including all new features and changes until the day when the next version, V20, will be released. |
 |
✔ Logbook! Up to date: Browse the logbook to find out the latest features and changes... |