Solder a wire to a board: Difference between revisions
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Select a single pole connector from the component data base. Search in the TARGET 3001!- component data base [[Image:InsertComponent.jpg|Icone to insert a component resp. for opening the component data base.]] for '''1X01'''. You will get the following image in order to insert either a male or female connector:<br><br> | Select a single pole connector from the component data base. Search in the TARGET 3001!- component data base [[Image:InsertComponent.jpg|Icone to insert a component resp. for opening the component data base.]] for '''1X01'''. You will get the following image in order to insert either a male or female connector:<br><br> | ||
[[Image: | [[Image:EinpoligerKontakt_e.jpg|500px|none|The component browser with suitable match]]Image: The component browser with suitable match. In the case shown a female connector is chosen.<br><br> | ||
Import the componennt to the schematic. Here you get a single pin which you would drop to any place of your schematic and connect it if needed. Now switch over to the layout view. [[Image:GotoPCB.jpg|Icon for changing to the layout view]] and place the pad. | |||
== | == With a drill hole (THT) == | ||
If a pad expects a wire/lead from a part (THT Pad, Through Hole Technique, plated through) it will appear in this shape to your layout:<br><br> | |||
[[Image:OnePad.jpg|150px| | [[Image:OnePad.jpg|150px|A single THT soldering pad|none]]image: A soldering pad meant for mounting a wired pad.<br><br> If you fade out the board material the soldering pad would look this way:<br><br> | ||
[[Image:Pad_blank.jpg|150px| | [[Image:Pad_blank.jpg|150px|A single THTLsoldering pad freed from the board material|none]]Image: a soldering pad, meant for mounting, soldering a a wired lead.<br><br><br> | ||
Form | Form and look of the pad can freely be edited, specially the copper height and width as well as the drill hole diameter. later any current leading connection can be soldered here, a wire or any other contacting element.<br><br> | ||
Double click [[M2]] on a soldering pad in the layout opens the dialog for edition. First release eventually this button: [[Image:SelByElem.jpg|Button for selecting the complete drawing when only hitting a part of it]]<br><br> | |||
[[Image:OnePadDlg.jpg|500px| | [[Image:OnePadDlg.jpg|500px|The dialog for the edition of a single THT soldering pad.|none]]Image: Double click on a soldering pad opens the dialog for edition.<br><br><br> | ||
== Without a drill hole SMD == | == Without a drill hole SMD == | ||
In order to make a THT pad a SMD one, take away its drilling and set the layer from 100 either to 16, copper top or 2, copper bottom.<br><br> | |||
In the dialog above named "Change soldering pad" simpla set the drill hole dialmeter to zero . This means: "No drilling". Now set the layer from ''100, AllCopperLayers'' to ''16, copper top'' or ''2, copper bottom''. So you get a SMD pad at the desired copper side.<br><br> | |||
[[Image:OnePadDlg2.jpg|500px| | [[Image:OnePadDlg2.jpg|500px|The dialog to edit a single THT-soldering Pad.|none]]Image: A little more copper width than height, Layer=16, drill hole diameter=0mm<br><br> | ||
<br><br> | <br><br> | ||
Result: | |||
<br><br> | <br><br> | ||
[[Image:OnePad2.jpg|150px| | [[Image:OnePad2.jpg|150px|a SMD pad|none]]Image: A little more copper width than hight. Layer=16, drill hole diameter=0mm<br><br><br><br> | ||
In der 3D | In der 3D view it looks that way: | ||
[[Image:smdPadBlank.jpg|150px|Ein einzelner SMD-Lötpunkt, mit Leiterplatte|none]]Bild: Ein SMD-Lötpunkt wird einfach zu einer verzinnten Kupferfläche auf der Leiterplatte.<br><br><br>Ohne Leiterplattenkörper bliebe in der 3D-Ansicht nur eine achteckige plane silbrige Fläche. Nicht sehr aufregend, aber genau das, was wir wollten.<br><br><br> | [[Image:smdPadBlank.jpg|150px|Ein einzelner SMD-Lötpunkt, mit Leiterplatte|none]]Bild: Ein SMD-Lötpunkt wird einfach zu einer verzinnten Kupferfläche auf der Leiterplatte.<br><br><br>Ohne Leiterplattenkörper bliebe in der 3D-Ansicht nur eine achteckige plane silbrige Fläche. Nicht sehr aufregend, aber genau das, was wir wollten.<br><br><br> | ||
Revision as of 16:50, 15 June 2015
How to solder a wire to your board?
By placing a one pole connector. How to do that?
With a counterpart in the schematic
Select a single pole connector from the component data base. Search in the TARGET 3001!- component data base 
for 1X01. You will get the following image in order to insert either a male or female connector:
Image: The component browser with suitable match. In the case shown a female connector is chosen.
Import the componennt to the schematic. Here you get a single pin which you would drop to any place of your schematic and connect it if needed. Now switch over to the layout view. 
and place the pad.
With a drill hole (THT)
If a pad expects a wire/lead from a part (THT Pad, Through Hole Technique, plated through) it will appear in this shape to your layout:
image: A soldering pad meant for mounting a wired pad.
If you fade out the board material the soldering pad would look this way:
Image: a soldering pad, meant for mounting, soldering a a wired lead.
Form and look of the pad can freely be edited, specially the copper height and width as well as the drill hole diameter. later any current leading connection can be soldered here, a wire or any other contacting element.
Double click M2 on a soldering pad in the layout opens the dialog for edition. First release eventually this button: 
Image: Double click on a soldering pad opens the dialog for edition.
Without a drill hole SMD
In order to make a THT pad a SMD one, take away its drilling and set the layer from 100 either to 16, copper top or 2, copper bottom.
In the dialog above named "Change soldering pad" simpla set the drill hole dialmeter to zero . This means: "No drilling". Now set the layer from 100, AllCopperLayers to 16, copper top or 2, copper bottom. So you get a SMD pad at the desired copper side.
Image: A little more copper width than height, Layer=16, drill hole diameter=0mm
Result:
Image: A little more copper width than hight. Layer=16, drill hole diameter=0mm
In der 3D view it looks that way:
Bild: Ein SMD-Lötpunkt wird einfach zu einer verzinnten Kupferfläche auf der Leiterplatte.
Ohne Leiterplattenkörper bliebe in der 3D-Ansicht nur eine achteckige plane silbrige Fläche. Nicht sehr aufregend, aber genau das, was wir wollten.
Without a counterpart in the schematic
In einem Projekt Ohne Schaltplan wählen Sie einfach das Gehäuse:
1X01_Buchse
Den damit verbundenen Lötpunkt setzen Sie nun beliebig in Ihrem Layout ab. Doppelklick darauf erlaubt das Editieren, wie oben.
Create a simple soldering area on "copper top" for example
Wählen sie im Layout die Zeichenfunktionen (Bleistift). Hier wählen Sie ein gefülltes Rechteck. Der Cursor ändert sich. Schweben Sie vor dem Zeichnen mit der Maus am rechten Bildschirmrand auf Ebene 16, Kupfer oben und klicken Sie rechts (M2). Jetzt ist Ebene 16 zum Zeichnen aktiviert, rötlich unterlegt. Legen Sie nun Ihr Rechteck ab. Es erscheint vollflächig in blau. Es handelt sich hier um eine Kupferfläche auf Kupfer oben. Kopieren Sie diese Fläche nochmals auf Ebene 18, Lötstopp oben, so dass das Pad frei von Lötstopplack bleibt. Wenn alle Ebenen sichtbar geschaltet sind, erscheint das Pad nun grün. Alles was grün ist, ist frei von Lötstopplack, also lötbar.
alias: Lötpad, Pad, Lötpunkt zum Anlöten eines Drahtes, ein polig einpolig einpohlig, Kontakt, Anschluss, en:Solder a wire to a board