Breadboard: Difference between revisions
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[[Image:PenExtBreadBoard.jpg|Mode Breadboard]]<br>Image: The mode to create a breadboard within a polygon<br><br><br><br> | |||
[[Image:BreadBoard.jpg|Create a breadboard within a polygon]]<br>Image: Create a breadboard within a polygon<br><br> | |||
Since version 19, you can easily create a breadboard in a polygonal area of the board in order to have room for expansion after the production of a board. This also can be used underneath an IC: Heat can be dissipated using vias .<br><br> | |||
'''How to reach this mode:'''<br> | |||
*with item "Breadboard polygon" in menu "Actions/Automatisms and Assistants" | |||
*with the tool [[image:BrdBrd.jpg]] under the icon [[Image:pen.jpg]]<br><br> | |||
How to leave this mode:<br> | |||
By '''[ESC]''' or '''[[M12]]'''<br><br> | |||
'''What you can do'''<br><br> | |||
Start to draw the polygon in question clicking [[M1]]. The polygon will be closed hitting the starting point exactly or simply by [[M2]] or by '''[Return]'''.<br> | |||
In the following dialog you can define the particularities of the breadboard:<br><br> | |||
[[image:LochrasterDlg_e.jpg|The dialog "Generate breadboard"]]<br>Image: The dialog "Generate breadboard"<br><br> | |||
'''Layer:''' Upon this layer the vias will appear<br> | |||
'''Signal:''' Shall the vias be assigned to a signal? This would make sense if the vias shall care for heat dissipation underneath an IC.<br> | |||
'''Via spacing:''' Grid width for the holes<br> | |||
'''Via diameter:''' Copper diameter of each via<br> | |||
'''Via drill hole:''' Drill hole diameter of each via<br><br> | |||
If the vias are created they can individually be selected and modified if "Select entire component" is switched off. Otherwise all vias are highlighten on one strike.<br><br> | |||
alias: via array | |||
[[de:Lochraster]][[fr:Zone_d´essai]] | [[de:Lochraster]][[fr:Zone_d´essai]] | ||
Latest revision as of 10:17, 16 August 2017
Image: The mode to create a breadboard within a polygon
Image: Create a breadboard within a polygon
Since version 19, you can easily create a breadboard in a polygonal area of the board in order to have room for expansion after the production of a board. This also can be used underneath an IC: Heat can be dissipated using vias .
How to reach this mode:
- with item "Breadboard polygon" in menu "Actions/Automatisms and Assistants"
- with the tool
under the icon 
How to leave this mode:
By [ESC] or M12
What you can do
Start to draw the polygon in question clicking M1. The polygon will be closed hitting the starting point exactly or simply by M2 or by [Return].
In the following dialog you can define the particularities of the breadboard:
Image: The dialog "Generate breadboard"
Layer: Upon this layer the vias will appear
Signal: Shall the vias be assigned to a signal? This would make sense if the vias shall care for heat dissipation underneath an IC.
Via spacing: Grid width for the holes
Via diameter: Copper diameter of each via
Via drill hole: Drill hole diameter of each via
If the vias are created they can individually be selected and modified if "Select entire component" is switched off. Otherwise all vias are highlighten on one strike.
alias: via array