Chip on board

From IBF-Wiki

Chip-on-board (COB) is a technology where uncoated chips (dice) are mounted directly on a PCB or a substrate of e.g. glassfibre epoxy (typically FR4). For the fact that the chip itself is very small compared to its package, the COB-electronics will be smaller.

Advantages of COB technology:

• Higher quality
  
• Smaller dimensions (in x and y but also reduced thickness, <1 mm!)
  
• Lower weight
  
• Increased thermal dissipation (no need for extra cooling)
  
• Improved performance
  
• Lower system costs
  
• Shorter lead-times
  
• Higher noise immunity
  
• Increased flexibility
  
• Fewer solder joints, Alternative foot prints
  
• Reduced environmental impact
  
  
  
  

Image by friendly permission of: www.emulation.com

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