Pastille avec des âmes - Historique des versions

Markus Friedrich le 13 novembre 2015 à 13:23

2015-11-13T13:23:57Z

← Version précédente		Version du 13 novembre 2015 à 15:23
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	Dans la nomenclature TARGET 3001! nous appelons cet construction un '''[[Freins thermiques (Thermal Pads)\|frein thermique]]'''. Un broche, ayant un signal de masse, ne pas sera encastré complettement dans la plan de masse, mais son connection sera effectué à l'aide des âmes. Il est pour prévenir le disparition de chaleur vers la plan de masse trés vite. Parce que cela pourrait créer des «joints de soudure à froid" (agens de soudure mis sur le pastille, mais aucune jonction conductrice).		Dans la nomenclature TARGET 3001! nous appelons cet construction un '''[[Freins thermiques (Thermal Pads)\|frein thermique]]'''. Un broche, ayant un signal de masse, ne pas sera encastré complettement dans la plan de masse, mais son connection sera effectué à l'aide des âmes. Il est pour prévenir le disparition de chaleur vers la plan de masse trés vite. Parce que cela pourrait créer des «joints de soudure à froid" (agens de soudure mis sur le pastille, mais aucune jonction conductrice).

	In TARGET ~~the connection of a ground plane takes place by the ground~~ signal ~~being embedded to the ground plane~~. ~~Its~~ signal ~~track has no~~ aura. ~~The~~ signal ~~track is embedded to the ground plane~~, ~~not the pad~~. ~~A pad in general keeps it's~~ aura ~~on all layers except you actively would delete it on certain layers~~. ~~In this respect a~~ TARGET ~~pad in a groundplane provides the best thermal commodities~~. ~~Adding~~ ligaments ~~here which lead into the ground plane reduce the~~ sustain ~~of temperature~~. ~~For optical reasons it is done nevertheless~~. ~~Please have a look at the~~ article '''[[Freins thermiques (Thermal Pads)\|frein thermique]]''' ~~to gather further information~~.~~<br>~~		Dans TARGET la connexion d'un plan de masse est effectué par le signal de masse étant intégré au plan de masse complettement. Sa piste de signal a pas d'aura. La piste de signal est intégré au plan de masse, mais non le pastille. Un pastille en général garde son aura sur toutes les couches sauf que vous souhaitez supprimer activement sur certaines couches. À cet égard, un TARGET pastille dans un plan de masse fournit le meilleur frein thermique. Ajouter ligaments ici qui conduisent chaleur dans le plan de masse réduit le sustain de la température. Pour des raisons optiques, il se fait quand même. S'il vous plaît jeter un oeil à l'article '''[[Freins thermiques (Thermal Pads)\|frein thermique]]''' pour recueillir de plus amples informations.


	~~alias: bridge in a pad~~

Markus Friedrich le 13 novembre 2015 à 12:34

2015-11-13T12:34:09Z

← Version précédente		Version du 13 novembre 2015 à 14:34
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	~~[[de:Stege im Pad]][[en:Ligaments in pads]]~~

			[[de:Stege im Pad]][[en:Ligaments in a pad]]




	[[de:Stege im Pad]][[en:Ligaments in a pad~~]][[fr:Pastille avec des âmes~~]]

Markus Friedrich le 13 novembre 2015 à 12:32

2015-11-13T12:32:55Z

← Version précédente		Version du 13 novembre 2015 à 14:32
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			[[de:Stege im Pad]][[en:Ligaments in pads]]
	[[de:Stege im Pad]][[fr:~~Pastille avec des âmes~~]]

Markus Friedrich le 13 novembre 2015 à 12:31

2015-11-13T12:31:23Z

← Version précédente		Version du 13 novembre 2015 à 14:31
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	Dans la nomenclature TARGET 3001! nous appelons cet construction un '''[[Freins thermiques (Thermal Pads)\|frein thermique]]'''. Un broche, ayant un signal de masse, ne pas sera encastré complettement dans la plan de masse, mais son connection sera effectué à l'aide des âmes. Il est pour prévenir le disparition de chaleur vers la plan de masse trés vite. Parce que cela pourrait créer des «joints de soudure à froid" (agens de soudure mis sur le pastille, mais aucune jonction conductrice).		Dans la nomenclature TARGET 3001! nous appelons cet construction un '''[[Freins thermiques (Thermal Pads)\|frein thermique]]'''. Un broche, ayant un signal de masse, ne pas sera encastré complettement dans la plan de masse, mais son connection sera effectué à l'aide des âmes. Il est pour prévenir le disparition de chaleur vers la plan de masse trés vite. Parce que cela pourrait créer des «joints de soudure à froid" (agens de soudure mis sur le pastille, mais aucune jonction conductrice).

	In TARGET the connection of a ground plane takes place by the ground signal being embedded to the ground plane. Its signal track has no aura. The signal track is embedded to the ground plane, not the pad. A pad in general keeps it's aura on all layers except you actively would delete it on certain layers. In this respect a TARGET pad in a groundplane provides the best thermal commodities. Adding ligaments here which lead into the ground plane reduce the sustain of temperature. For optical reasons it is done nevertheless. Please have a look at the article [[Thermal Pads]] to gather further information.<br>		In TARGET the connection of a ground plane takes place by the ground signal being embedded to the ground plane. Its signal track has no aura. The signal track is embedded to the ground plane, not the pad. A pad in general keeps it's aura on all layers except you actively would delete it on certain layers. In this respect a TARGET pad in a groundplane provides the best thermal commodities. Adding ligaments here which lead into the ground plane reduce the sustain of temperature. For optical reasons it is done nevertheless. Please have a look at the article '''[[Freins thermiques (Thermal Pads)\|frein thermique]]''' to gather further information.<br>

Markus Friedrich le 13 novembre 2015 à 12:30

2015-11-13T12:30:56Z

← Version précédente		Version du 13 novembre 2015 à 14:30
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	[[image:thermalpad.jpg]]<br>Image: Are you thinking of something like this?<br><br><br>		[[image:thermalpad.jpg]]<br>Image: Are you thinking of something like this?<br><br><br>

	~~In the~~ TARGET 3001! ~~usage this~~ construction ~~is called~~ un '''[[Freins thermiques (Thermal Pads)\|frein thermique]]'''. ~~A pad with a ground~~ signal ~~is not going to be embedded completely into the Ground plane but gets connected only ba ligaments~~. ~~It is to avoid a "drain too quick" of soldering temperature into the ground plane~~. ~~Because this might lead to "cold solder joints~~" (~~solder~~ agens ~~placed on the pad but no conducting junction~~).		Dans la nomenclature TARGET 3001! nous appelons cet construction un '''[[Freins thermiques (Thermal Pads)\|frein thermique]]'''. Un broche, ayant un signal de masse, ne pas sera encastré complettement dans la plan de masse, mais son connection sera effectué à l'aide des âmes. Il est pour prévenir le disparition de chaleur vers la plan de masse trés vite. Parce que cela pourrait créer des «joints de soudure à froid" (agens de soudure mis sur le pastille, mais aucune jonction conductrice).

	In TARGET the connection of a ground plane takes place by the ground signal being embedded to the ground plane. Its signal track has no aura. The signal track is embedded to the ground plane, not the pad. A pad in general keeps it's aura on all layers except you actively would delete it on certain layers. In this respect a TARGET pad in a groundplane provides the best thermal commodities. Adding ligaments here which lead into the ground plane reduce the sustain of temperature. For optical reasons it is done nevertheless. Please have a look at the article [[Thermal Pads]] to gather further information.<br>		In TARGET the connection of a ground plane takes place by the ground signal being embedded to the ground plane. Its signal track has no aura. The signal track is embedded to the ground plane, not the pad. A pad in general keeps it's aura on all layers except you actively would delete it on certain layers. In this respect a TARGET pad in a groundplane provides the best thermal commodities. Adding ligaments here which lead into the ground plane reduce the sustain of temperature. For optical reasons it is done nevertheless. Please have a look at the article [[Thermal Pads]] to gather further information.<br>

Markus Friedrich le 13 novembre 2015 à 12:01

2015-11-13T12:01:46Z

← Version précédente		Version du 13 novembre 2015 à 14:01
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	[[image:thermalpad.jpg]]<br>Image: Are you thinking of something like this?<br><br><br>		[[image:thermalpad.jpg]]<br>Image: Are you thinking of something like this?<br><br><br>

	In the TARGET 3001! usage this construction is called un '''[[Freins ~~Thermiques~~\|frein thermique]]'''. A pad with a ground signal is not going to be embedded completely into the Ground plane but gets connected only ba ligaments. It is to avoid a "drain too quick" of soldering temperature into the ground plane. Because this might lead to "cold solder joints" (solder agens placed on the pad but no conducting junction).		In the TARGET 3001! usage this construction is called un '''[[Freins thermiques (Thermal Pads)\|frein thermique]]'''. A pad with a ground signal is not going to be embedded completely into the Ground plane but gets connected only ba ligaments. It is to avoid a "drain too quick" of soldering temperature into the ground plane. Because this might lead to "cold solder joints" (solder agens placed on the pad but no conducting junction).

	In TARGET the connection of a ground plane takes place by the ground signal being embedded to the ground plane. Its signal track has no aura. The signal track is embedded to the ground plane, not the pad. A pad in general keeps it's aura on all layers except you actively would delete it on certain layers. In this respect a TARGET pad in a groundplane provides the best thermal commodities. Adding ligaments here which lead into the ground plane reduce the sustain of temperature. For optical reasons it is done nevertheless. Please have a look at the article [[Thermal Pads]] to gather further information.<br>		In TARGET the connection of a ground plane takes place by the ground signal being embedded to the ground plane. Its signal track has no aura. The signal track is embedded to the ground plane, not the pad. A pad in general keeps it's aura on all layers except you actively would delete it on certain layers. In this respect a TARGET pad in a groundplane provides the best thermal commodities. Adding ligaments here which lead into the ground plane reduce the sustain of temperature. For optical reasons it is done nevertheless. Please have a look at the article [[Thermal Pads]] to gather further information.<br>

Markus Friedrich le 13 novembre 2015 à 12:00

2015-11-13T12:00:51Z

← Version précédente		Version du 13 novembre 2015 à 14:00
Ligne 1 :		Ligne 1 :
	[[image:thermalpad.jpg]]<br>Image: Are you thinking of something like this?<br><br><br>		[[image:thermalpad.jpg]]<br>Image: Are you thinking of something like this?<br><br><br>

	In the TARGET 3001! usage this construction is called '''[[~~Thermal Pads~~\|~~a thermal pad~~]]'''. A pad with a ground signal is not going to be embedded completely into the Ground plane but gets connected only ba ligaments. It is to avoid a "drain too quick" of soldering temperature into the ground plane. Because this might lead to "cold solder joints" (solder agens placed on the pad but no conducting junction).		In the TARGET 3001! usage this construction is called un '''[[Freins Thermiques\|frein thermique]]'''. A pad with a ground signal is not going to be embedded completely into the Ground plane but gets connected only ba ligaments. It is to avoid a "drain too quick" of soldering temperature into the ground plane. Because this might lead to "cold solder joints" (solder agens placed on the pad but no conducting junction).

	In TARGET the connection of a ground plane takes place by the ground signal being embedded to the ground plane. Its signal track has no aura. The signal track is embedded to the ground plane, not the pad. A pad in general keeps it's aura on all layers except you actively would delete it on certain layers. In this respect a TARGET pad in a groundplane provides the best thermal commodities. Adding ligaments here which lead into the ground plane reduce the sustain of temperature. For optical reasons it is done nevertheless. Please have a look at the article [[Thermal Pads]] to gather further information.<br>		In TARGET the connection of a ground plane takes place by the ground signal being embedded to the ground plane. Its signal track has no aura. The signal track is embedded to the ground plane, not the pad. A pad in general keeps it's aura on all layers except you actively would delete it on certain layers. In this respect a TARGET pad in a groundplane provides the best thermal commodities. Adding ligaments here which lead into the ground plane reduce the sustain of temperature. For optical reasons it is done nevertheless. Please have a look at the article [[Thermal Pads]] to gather further information.<br>

Markus Friedrich le 13 novembre 2015 à 11:24

2015-11-13T11:24:05Z

← Version précédente		Version du 13 novembre 2015 à 13:24
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	[[image:thermalpad.jpg]]<br>~~Bild~~: ~~Meinen Sie so etwas~~?<br><br><br>		[[image:thermalpad.jpg]]<br>Image: Are you thinking of something like this?<br><br><br>

	Im TARGET 3001! ~~Sprachgebrauch heißt diese Konstruktion~~ '''[[~~Wärmefalle~~]]''' ~~oder engl~~.~~: Thermal Pad~~. Ein Pad mit Massesignal ist nicht vollflächig in die Massefläche eingebettet sondern nur über Stege mit ihr verbunden. Hierdurch soll verhindert werden, dass beim Löten die Wärme zu schnell in die Massefläche abfließt, was zu sog. "~~kalten Lötstellen~~" ~~führen kann~~ (~~Lot sitzt zwar auf dem Pad, hat aber keine elektrische Verbindung~~).		In the TARGET 3001! usage this construction is called '''[[Thermal Pads\|a thermal pad]]'''. A pad with a ground signal is not going to be embedded completely into the Ground plane but gets connected only ba ligaments. It is to avoid a "drain too quick" of soldering temperature into the ground plane. Because this might lead to "cold solder joints" (solder agens placed on the pad but no conducting junction).

	In TARGET ~~findet der Anschluss an eine Massefläche über die Signalbahn statt~~, ~~die keine Aura hat~~. ~~Die Signalbahn ist also~~ in ~~die Massefläche eingebettet, nicht das Pad~~. ~~Ein Pad behält grundsätzlich die Aura auf allen Ebenen~~. ~~So gesehen, ist ein TARGET-Pad die bestmögliche Wärmefalle~~. ~~Hier Stege anzubringen, die in die Massefläche führen, ist einem Wärmeerhalt eher abträglich~~. ~~Aus rein optischen Gründen wird es aber trotzdem gerne gemacht~~. ~~Bitte schauen Sie~~ im ~~Artikel~~ [[~~Wärmefalle~~]] ~~wie man das in TARGET konstruiert.~~		In TARGET the connection of a ground plane takes place by the ground signal being embedded to the ground plane. Its signal track has no aura. The signal track is embedded to the ground plane, not the pad. A pad in general keeps it's aura on all layers except you actively would delete it on certain layers. In this respect a TARGET pad in a groundplane provides the best thermal commodities. Adding ligaments here which lead into the ground plane reduce the sustain of temperature. For optical reasons it is done nevertheless. Please have a look at the article [[Thermal Pads]] to gather further information.<br>


			alias: bridge in a pad





			[[de:Stege im Pad]][[fr:Pastille avec des âmes]]

	~~alias: Stege im Lötpunkt, Brücken im Pad, Brücken im Lötpunkt~~

Markus Friedrich : Page créée avec « image:thermalpad.jpg
Bild: Meinen Sie so etwas?

Im TARGET 3001! Sprachgebrauch heißt diese Konstruktion '''Wärmefalle''' oder engl.: Thermal Pad.... »

2015-11-13T10:51:44Z

Page créée avec « image:thermalpad.jpg Bild: Meinen Sie so etwas? Im TARGET 3001! Sprachgebrauch heißt diese Konstruktion '''Wärmefalle''' oder engl.: Thermal Pad.... »

Nouvelle page

[[image:thermalpad.jpg]] Bild: Meinen Sie so etwas? 

Im TARGET 3001! Sprachgebrauch heißt diese Konstruktion '''[[Wärmefalle]]''' oder engl.: Thermal Pad. Ein Pad mit Massesignal ist nicht vollflächig in die Massefläche eingebettet sondern nur über Stege mit ihr verbunden. Hierdurch soll verhindert werden, dass beim Löten die Wärme zu schnell in die Massefläche abfließt, was zu sog. "kalten Lötstellen" führen kann (Lot sitzt zwar auf dem Pad, hat aber keine elektrische Verbindung).

In TARGET findet der Anschluss an eine Massefläche über die Signalbahn statt, die keine Aura hat. Die Signalbahn ist also in die Massefläche eingebettet, nicht das Pad. Ein Pad behält grundsätzlich die Aura auf allen Ebenen. So gesehen, ist ein TARGET-Pad die bestmögliche Wärmefalle. Hier Stege anzubringen, die in die Massefläche führen, ist einem Wärmeerhalt eher abträglich. Aus rein optischen Gründen wird es aber trotzdem gerne gemacht. Bitte schauen Sie im Artikel [[Wärmefalle]] wie man das in TARGET konstruiert.

alias: Stege im Lötpunkt, Brücken im Pad, Brücken im Lötpunkt

[[de:Stege im Pad]][[en:Ligaments in a pad]][[fr:Pastille avec des âmes]]