Solder paste - Revision history

Markus Friedrich at 11:36, 16 September 2015

2015-09-16T11:36:10Z

← Older revision		Revision as of 13:36, 16 September 2015
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	[[image:e_padaenddlg3.jpg\|The Change Pad dialog]]<br>Image: The dialog to change a pad, even ~~his~~ solder paste ~~application~~<br><br><br>		[[image:e_padaenddlg3.jpg\|The Change Pad dialog]]<br>Image: The dialog to change a pad, even the mightyness of its solder paste dispension<br><br><br>

	You may reduce the dispension of solder paste on each pad individually by 5, 10, 15, 20, and 25% relative to the size of the pad.		You may reduce the dispension of solder paste on each pad individually by 5, 10, 15, 20, and 25% relative to the size of the pad.

Markus Friedrich at 11:34, 16 September 2015

2015-09-16T11:34:39Z

← Older revision		Revision as of 13:34, 16 September 2015
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	[[image:e_padaenddlg3.jpg\|The Change Pad dialog]]<br>Image: The dialog to change a pad, even his solder paste application<br>		[[image:e_padaenddlg3.jpg\|The Change Pad dialog]]<br>Image: The dialog to change a pad, even his solder paste application<br><br><br>

	You may reduce the dispension of solder paste on each pad individually by 5, 10, 15, 20, and 25% relative to the size of the pad.		You may reduce the dispension of solder paste on each pad individually by 5, 10, 15, 20, and 25% relative to the size of the pad.

Markus Friedrich at 11:34, 16 September 2015

2015-09-16T11:34:08Z

← Older revision		Revision as of 13:34, 16 September 2015
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	[[image:stencil.jpg\|Image source: www.pcb-pool.com]]<br>A stencil for the application of solder paste<br><br>		[[image:stencil.jpg\|Image source: www.pcb-pool.com]]<br>A stencil for the application of solder paste<br><br>


	The stencil gets exactly superposed over the PCB and with a doctor knife the solder paste is spread and scraped off the steel. A little bit of the paste remains in the holes over the pads. When the stencil is taken off, these little depots are to be found exactly where they are supposed to be: on the pads.		The stencil gets exactly superposed over the PCB and with a doctor knife the solder paste is spread and scraped off the steel. A little bit of the paste remains in the holes over the pads. When the stencil is taken off, these little depots are to be found exactly where they are supposed to be: on the pads.
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	[[image:e_padaenddlg3.jpg\|The dialog to change a pad, even his solder paste application~~]]<br>~~<br>		[[image:e_padaenddlg3.jpg\|The Change Pad dialog]]<br>Image: The dialog to change a pad, even his solder paste application<br>


	You may reduce the dispension of solder paste on each pad individually by 5, 10, 15, 20, and 25% relative to the size of the pad.		You may reduce the dispension of solder paste on each pad individually by 5, 10, 15, 20, and 25% relative to the size of the pad.
	You also may keep pads completely free of solder paste in order to draw a figure of customized (smaller) size on the solder paste layer.		You also may keep pads completely free of solder paste in order to draw a figure of customized (smaller) size on the solder paste layer.

Markus Friedrich at 11:32, 16 September 2015

2015-09-16T11:32:16Z

← Older revision		Revision as of 13:32, 16 September 2015
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	Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique (principle: baking oven). Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils. The pattern of the soldering pads exactly is cut out of a thin sheet of steel by the use of a laser. The steel sheet with the pattern of holes is the stencil.<br>		Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique (principle: baking oven). Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils. The pattern of the soldering pads exactly is cut out of a thin sheet of steel by the use of a laser. The steel sheet with the pattern of holes is the stencil.<br>

	[[image:stencil.jpg\|~~Bildquelle~~: www.pcb-pool.com]]<br>A stencil for the application of solder paste<br><br>		[[image:stencil.jpg\|Image source: www.pcb-pool.com]]<br>A stencil for the application of solder paste<br><br>


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	[[image:e_padaenddlg3.jpg\|~~400px~~]]<br><br>		[[image:e_padaenddlg3.jpg\|The dialog to change a pad, even his solder paste application]]<br><br>

Markus Friedrich at 11:21, 16 September 2015

2015-09-16T11:21:01Z

← Older revision		Revision as of 13:21, 16 September 2015
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	Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique (principle: baking oven). Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils. The pattern of the soldering pads exactly is cut out of a thin sheet of steel by the use of a laser. The steel sheet with the pattern of holes is the stencil.		Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique (principle: baking oven). Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils. The pattern of the soldering pads exactly is cut out of a thin sheet of steel by the use of a laser. The steel sheet with the pattern of holes is the stencil.<br>

			[[image:stencil.jpg\|Bildquelle: www.pcb-pool.com]]<br>A stencil for the application of solder paste<br><br>

	~~[[image:stencil.jpg\|Bildquelle: www.pcb-pool.com]]<br>A stencil for the application of solder paste<br>~~

	The stencil gets exactly superposed over the PCB and with a doctor knife the solder paste is spread and scraped off the steel. A little bit of the paste remains in the holes over the pads. When the stencil is taken off, these little depots are to be found exactly where they are supposed to be: on the pads.		The stencil gets exactly superposed over the PCB and with a doctor knife the solder paste is spread and scraped off the steel. A little bit of the paste remains in the holes over the pads. When the stencil is taken off, these little depots are to be found exactly where they are supposed to be: on the pads.

Markus Friedrich at 09:20, 16 September 2015

2015-09-16T09:20:33Z

← Older revision		Revision as of 11:20, 16 September 2015
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	~~== Special application: A customized solder paste shape on a pad ==~~

	== Special application: A customized solder paste shape on a pad ==		== Special application: A customized solder paste shape on a pad ==

Markus Friedrich at 08:50, 16 September 2015

2015-09-16T08:50:11Z

@@ Line 33: / Line 33: @@
 == Special application: A customized solder paste shape on a pad ==
-oioiu
+== Special application: A customized solder paste shape on a pad ==
 [[Category:Elements]]

Markus Friedrich at 07:48, 16 September 2015

2015-09-16T07:48:22Z

← Older revision		Revision as of 09:48, 16 September 2015
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	You also may keep pads completely free of solder paste in order to draw a figure of customized (smaller) size on the solder paste layer.		You also may keep pads completely free of solder paste in order to draw a figure of customized (smaller) size on the solder paste layer.

	~~Information~~ on ~~[[Solder stop]] please see there...~~
			== Special application: A customized solder paste shape on a pad ==

			oioiu

	[[Category:Elements]]		[[Category:Elements]]

Markus Friedrich at 07:45, 16 September 2015

2015-09-16T07:45:29Z

← Older revision		Revision as of 09:45, 16 September 2015
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	Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique (principle: baking oven). Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils. The pattern of the soldering pads exactly is cut out of a thin sheet of steel by the use of a laser. The steel sheet with the pattern of holes is the stencil.		Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique (principle: baking oven). Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils. The pattern of the soldering pads exactly is cut out of a thin sheet of steel by the use of a laser. The steel sheet with the pattern of holes is the stencil.

			[[image:stencil.jpg\|Bildquelle: www.pcb-pool.com]]<br>A stencil for the application of solder paste<br>

	~~Die Stahlplatte mit Lochmuster ist der Stencil~~. ~~Er wird deckungsgleich auf die Platine gelegt und mit einem Rakel wird dann die Lötpaste darüber gestrichen~~. ~~In den Löchern über den Pads bleibt die Lötpaste zurück und beim Abnehmen der Schablone verbleiben kleine Lotdepots auf den Pads~~.		The stencil gets exactly superposed over the PCB and with a doctor knife the solder paste is spread and scraped off the steel. A little bit of the paste remains in the holes over the pads. When the stencil is taken off, these little depots are to be found exactly where they are supposed to be: on the pads.

	~~[[image:stencil.jpg\|Ein Stencil (Löpastenschablone)\|Bildquelle: www.pcb-pool.com]]<br><br>~~		The size of the little solderpaste depots on pads can be edited in TARGET 3001! in the dialog '''"Change Pads"'''. Open it by doubleclick '''[[M11]]''' on a pad. Another way is highlighting the complete layout and then pressing key '''[e]''' for <u>e</u>dit. Select "Pads" in the flashing dialog and do the solder paste settings in the "Change pads" dialog.<br><br>

	~~Solderpaste~~ on pads in TARGET 3001! ~~can be edited~~ in the dialog '''"Change Pads"'''. Open it by doubleclick '''[[M11]]''' on a pad. Another way is highlighting the complete layout and then pressing key '''[e]''' for ~~edit~~. Select "Pads" in the flashing dialog and do the solder paste settings in the "Change pads" dialog.<br><br>

	{\| cellspacing="0" cellpadding="10" style="width:250px; float:right; border:1px solid #CCCCCC; background-color:#F9F9F9; margin:0 0 0.5em 1em;"		{\| cellspacing="0" cellpadding="10" style="width:250px; float:right; border:1px solid #CCCCCC; background-color:#F9F9F9; margin:0 0 0.5em 1em;"

Markus Friedrich at 07:15, 16 September 2015

2015-09-16T07:15:19Z

← Older revision		Revision as of 09:15, 16 September 2015
Line 1:		Line 1:
	Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique. Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils.		Solder paste is a suspension of solder powder and carrier agens to create a solder deposit upon a pad for soldering in reflow technique (principle: baking oven). Solder paste is needed when components in SMD housings are used in layouts. Solder paste is dispensed in various techniques for example by the use of stencils. The pattern of the soldering pads exactly is cut out of a thin sheet of steel by the use of a laser. The steel sheet with the pattern of holes is the stencil.



			Die Stahlplatte mit Lochmuster ist der Stencil. Er wird deckungsgleich auf die Platine gelegt und mit einem Rakel wird dann die Lötpaste darüber gestrichen. In den Löchern über den Pads bleibt die Lötpaste zurück und beim Abnehmen der Schablone verbleiben kleine Lotdepots auf den Pads.

			[[image:stencil.jpg\|Ein Stencil (Löpastenschablone)\|Bildquelle: www.pcb-pool.com]]<br><br>

	Solderpaste on pads in TARGET 3001! can be edited in the dialog '''"Change Pads"'''. Open it by doubleclick '''[[M11]]''' on a pad. Another way is highlighting the complete layout and then pressing key '''[e]''' for edit. Select "Pads" in the flashing dialog and do the solder paste settings in the "Change pads" dialog.<br><br>		Solderpaste on pads in TARGET 3001! can be edited in the dialog '''"Change Pads"'''. Open it by doubleclick '''[[M11]]''' on a pad. Another way is highlighting the complete layout and then pressing key '''[e]''' for edit. Select "Pads" in the flashing dialog and do the solder paste settings in the "Change pads" dialog.<br><br>